Power chips are linked to exterior circuits through packaging, and their efficiency depends upon the support of the product packaging. In high-power situations, power chips are normally packaged as power components. Chip affiliation refers to the electrical connection on the upper surface area of the chip, which is typically light weight aluminum bonding wire in conventional modules. ^
Traditional power module plan cross-section
At present, business silicon carbide power modules still primarily utilize the product packaging innovation of this wire-bonded standard silicon IGBT module. They encounter troubles such as big high-frequency parasitic specifications, not enough heat dissipation capability, low-temperature resistance, and inadequate insulation strength, which limit using silicon carbide semiconductors. The display screen of exceptional efficiency. In order to solve these issues and totally manipulate the massive potential benefits of silicon carbide chips, lots of new packaging innovations and remedies for silicon carbide power components have actually arised in recent times.
Silicon carbide power module bonding technique
(Figure (a) Wire bonding and (b) Cu Clip power module structure diagram (left) copper wire and (right) copper strip connection process)
Bonding materials have actually developed from gold cord bonding in 2001 to light weight aluminum cord (tape) bonding in 2006, copper cord bonding in 2011, and Cu Clip bonding in 2016. Low-power tools have established from gold cords to copper cables, and the driving pressure is expense decrease; high-power gadgets have actually created from aluminum wires (strips) to Cu Clips, and the driving force is to boost product efficiency. The greater the power, the higher the needs.
Cu Clip is copper strip, copper sheet. Clip Bond, or strip bonding, is a product packaging process that makes use of a solid copper bridge soldered to solder to attach chips and pins. Compared to conventional bonding packaging techniques, Cu Clip innovation has the complying with advantages:
1. The link between the chip and the pins is made of copper sheets, which, to a particular extent, replaces the common cable bonding approach between the chip and the pins. For that reason, a special bundle resistance worth, greater existing circulation, and far better thermal conductivity can be obtained.
2. The lead pin welding area does not need to be silver-plated, which can totally save the price of silver plating and inadequate silver plating.
3. The item appearance is completely consistent with normal items and is primarily utilized in web servers, mobile computer systems, batteries/drives, graphics cards, motors, power products, and various other fields.
Cu Clip has 2 bonding methods.
All copper sheet bonding method
Both the Gate pad and the Source pad are clip-based. This bonding method is more pricey and complex, but it can attain better Rdson and far better thermal effects.
( copper strip)
Copper sheet plus cord bonding technique
The source pad utilizes a Clip method, and eviction makes use of a Cable method. This bonding method is somewhat more affordable than the all-copper bonding approach, conserving wafer area (relevant to extremely small gate locations). The procedure is simpler than the all-copper bonding approach and can get far better Rdson and far better thermal effect.
Vendor of Copper Strip
TRUNNANOÂ is a supplier of surfactant with over 12 years experience in nano-building energy conservation and nanotechnology development. It accepts payment via Credit Card, T/T, West Union and Paypal. Trunnano will ship the goods to customers overseas through FedEx, DHL, by air, or by sea. If you are finding copper clip, please feel free to contact us and send an inquiry.
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